title: INVESTIGATION OF BARRIER LAYERS FOR THE FORMATION OF COPPER VIAS
abstract: The paper investigates possible barrier layers (Ti/TiN/Ti, Ti/TiN/Ta, TaN/Ta) for forming vias to transistor structures made of copper.
journal: International Forum “Microelectronics – 2020”. Joung Scientists Scholarship “Microelectronics – 2020”. XIII International conference «Silicon – 2020». XII young scientists scholarship for silicon nanostructures and devices physics, material science, process and analysis