title: INVESTIGATION OF ULTRA-THIN SILICON WAFERS STRENGTH DEPENDING ON WAFER MATERIAL GROWING METHODS AND SURFACE TREATMENT
abstract: The mechanical strength of ultra-thin 100 μm Si wafers was measured depending on Si growing methods and machining modes of wafer surface preparation (abrasive grinding, diamond paste polishing, chemical-mechanical polishing — CMP)
journal: International Forum “Microelectronics – 2020”. Joung Scientists Scholarship “Microelectronics – 2020”. XIII International conference «Silicon – 2020». XII young scientists scholarship for silicon nanostructures and devices physics, material science, process and analysis