title: FOREIGN METHODS FOR ASSESSING THE RELIABILITY OF ELECTRONIC COMPONENTS
abstract: The article discusses foreign standards for determining the parameters of the reliability of microcircuits, a comparative analysis of methods for calculating reliability and their applicability to domestic microcircuits is carried out.
journal: International Forum “Microelectronics – 2020”. Joung Scientists Scholarship “Microelectronics – 2020”. XIII International conference «Silicon – 2020». XII young scientists scholarship for silicon nanostructures and devices physics, material science, process and analysis