- Well, the other day I did a piece about the complicity of the media concerning moslem crimes.
THEN the story broke about how Obama was illegally spying on them all. Surely now, I foolishly thought to my self, the last remaining vestige of honesty within their ranks will awaken …? NOPE! But it makes sense, really – Brobama IS a moslem, and sorta ‘Black!’
Today’s Ottawa Citizen re-print shows the media is over; it’s done. The only thing left to do with it is a quick trip to the vomitorium.
From: The Ottawa Citizen, Friday May 17, 2013, P.#A9.
OBAMA ON THE OFFENSIVE
Tries to regain control, momentum amid growing controversies
“Obama is trying to shake off the perception that he has been passive
on issues such as the IRS Justice Department investigation.”
THE ASSOCIATED PRESS
U.S. President Barack Obama confronted a trio of controversies Thursday, pledging to work with Congress to ensure the federal tax agency doesn’t abuse its power and urging legislators to provide more money to strengthen security at U.S. diplomatic outposts to prevent attacks like the raid that killed four Americans in Libya last year.
He also promised to seek “a balance” between national security and a need to protect freedom of the press, responding to an outcry over the government’s seizure of telephone records of The Associated Press.
The president is trying to shake off a growing perception that he has been passive in responding to a series of developments that threaten to derail his second-term agenda and ensnare his White House in Republican-led congressional investigations.
THAT STATEMENT IS A DELIBERATE RED-HERRING DISTRACTION AND EVASION OF THE TRUTH, OBVIOUSLY DESIGNED TO AVOID ADMITTING TO IT: THERE IS NO PERCEPTION THAT HE HAS BEEN PASSIVE CONCERNING HIS ATROCITIES; THERE IS, INSTEAD, ABSOLUTE CERTAINTY HE HAS BEEN AGGRESSIVELY BREAKING THE LAWS OF THE LAND, TO HARRASS AND SPY ON HIS PERCEIVED ENEMIES.
AND OF COURSE OBVIOUSLY, (SARCASM) THERE WOULD BE NO NEED FOR ANY INVESTIGATIONS INTO “THE GOVERMNENT” (OBAMA HIMSELF) IF IT WEREN’T FOR THOSE DARNED PREJUDICED HATER/RACIST/BIGOT REPUBLICANS!
Hoping to regain momentum, Obama has released this week a trove of documents related to the Benghazi terror attacks amid pressure from Republicans, asked Congress to revive action on the shield law and forced the resignation of the top Internal Revenue Service official.
“THE” TOP IRS OFFICIAL? HARDLY! AND – A “TROVE!”? A REDACTED PILE OF NADA!
The president is expected to nominate a new acting IRS commissioner this week to replace Steven Miller, who resigned Wednesday.
i.e: THE FIX IS IN
“I think we’re going to be able to fix it,” Obama said, speaking in particular of the IRS’ targeting of conservative groups for special scrutiny. He vowed to make sure the agency is “doing its job scrupulously and without even a hint of bias.”
TOO LITTLE, TOO LATE, ISN’T IT, “PRESIDENT” ZERO?!
The president had addressed the IRS controversy on Monday, but his measured words left many unsatisfied, particularly given that he had waited three days to address the developments. He also repeatedly asserted that he was waiting to find out if the reports were accurate, even though top officials had already acknowledged the controversial actions.
HOW STRANGE – PRETENDING SOMETHING WASN’T YET KNOWN TO HAVE ACTUALLY HAPPENED, WHEN IT HAD ALREADY BEEN OFFICIALLY ADMITTED TO IN PUBLIC.
Obama, speaking Thursday at a rainy Rose Garden news conference with Turkish Prime Minister Recep Thyyip Erdogan, tried to steer clear of Republican criticism of the administration’s response to the terror attacks that killed four Americans last year in Benghazi, Libya. He called on Congress to work with the White House to provide more money to strengthen U.S. diplomatic missions’ security.
BECAUSE IT’S OBVIOUSLY CONGRESS’ FAULT THAT HE HAD PERSONALLY DENIED THEM SECURITY AND THEN WHEN THEY GOT ATTACKED, VETOED SENDING THEM ANY REINFORCEMENTS, IN FACT DIRECTLY ORDERING THEM TO “STAND DOWN!”?
“We need to come together and truly honour the sacrifice of those four courageous Americans and better secure our diplomatic posts around the world,” Obama said. “That’s how we learn the lessons of Benghazi. That’s how we keep faith with the men and women who we send overseas to represent America.”
FAITH?! HOW ABOUT SOME FACTS, ZERO!?
Republicans have hammered the administration since the September attacks, which killed a U.S. ambassador. They are outraged that senior administration officials pushed for references to prior warnings and al-Qaida to be deleted ftom the talking points used by UN Ambassador Susan Rice five days after the attack.
Obama also was asked about the government’s seizure of telephone records of reporters and editors of The Associated Press in an investigation of news leaks. The president said he would not comment on that specific case but said that “leaks related to national security can put people at risk.”
IN OTHER WORDS, HE’S PISSED THAT HIS MINIONS GOT CAUGHT, NOT THAT HE FORCED THEM TO BREAK THE LAW IN THE FIRST PLACE.
At the same time, he said, the government has an obligation to be open. He said the challenge was to find an appropriate balance between secrecy and the right to know.
THAT’S CALLED “THE LAW,” OBAMA; OBJECTIVE FACT, NOT SUBJECTIVE OPINION.
Noting the presence of U.S. troops and intelligence officers in risky situations around the world, Obama said, “Part of my job is to make sure that we’re protecting what they do while still accommodating, for the need for the public to be informed and to be able to hold my office accountable.”
AND SO, AS IS OBVIOUS FROM THIS VERY ARTICLE, THE COMPLICIT AND SUPINE AP CONTINUES TO REFUSE TO DO BOTH.
The media are racists, whose permanent narrative concerning Obama and his moslem bruthahs, is that they can do no wrong (the underlying implication being, because he and the other “swarthy” moslems are racially and mentally inferior, they can never be held to be intelligent enough to warrant being judged responsible for their own otherwise criminal actions)!
BUT IF IT WERE A WHITE MAN COMMITTING THESE HIGH TREASON CRIMES … !
Check out Andrew Klavan’s take on the media here:


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domain: medical


Having your car not start can be very stressful, especially since it tends to happen at the worst of times. Since there are a lot of different issues that can stop a car from starting, here are a few of the most common causes.
The battery might be dead. When you try turning on the headlights with the ignition turned, if nothing happens than this is the problem.
The cables connecting the battery might be faulty, dirty, or even completely disconnected.
Sometimes when your car won't start on a cold day or when your car starts but immediately dies, the culprit is your car's carburetor.
This may sound a little obvious, but you might be out of gasoline. If you haven't been as diligent in filling up as often as you should, it may be time to get a gas container and a ride to the gas station.
In almost any case of having a non-starting car, we recommend that you get your car towed to the nearest service center to have it checked out.


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By Gladys Dorn on February 11 2018 00:50:44
Modern non-metallic sheathed cables, such as (US and Canadian) Types NMB and NMC, consist of two to four wires covered with thermoplastic insulation, plus a bare wire for grounding (bonding), surrounded by a flexible plastic jacket. Some versions wrap the individual conductors in paper before the plastic jacket is applied.
Use wiring diagrams to assist in building or manufacturing the circuit or electronic device. They are also useful for making repairs. DIY enthusiasts use wiring diagrams but they are also common in home building and auto repair.
A wiring diagram is a simplified conventional pictorial representation of an electrical circuit. It shows the components of the circuit as simplified shapes, and the power and signal connections between the devices. A wiring diagram is often used to troubleshoot problems and to make sure that all the connections have been made and that everything is present.
Essential for pre-study works, the wiring diagram allows the cable list to be produced. If the wiring diagram is useful during the pre-study phase, it is also an important tool for the design of the installation functional scheme. Starting with the wiring diagram, the user can start producing his installation as a pre-study, and then launch his study during the installation cabling, allowing a reduced production time.

domain: design


Climatological database belongs to the usual means of meteorological institutes of today. The main reason of its utilization is storage of all collected meteorological data in one unified structure to avoid data inconsistencies and discrepancies and to enable standard comfortable data access for all users and other software systems.
1) World Meteorological Organization
No additional data storage and no different and confusing data formats are needed.
Within the Climatological database (CLDB), the above-mentioned unified structure is based on SQL Database Server and the standard data access is based on SQL language. CLDB is based on WMO(1) recommended practices for climatological data processing (WMO Guide No. 100). It follows the WMO suggestion of a RDBMS (Relation Database Management System) application with wide use in climatology (World Climate Program efforts concerning new Climate Data Management Systems - CDMSs).
Great advantage of CLDB is modular architecture, which gives end user possibility of detailed customization. End user can specify additional non-standard input and output modules. Modules can be easily implemented and added to any existing or future installation. One of the most interesting extensions offered is upgrade to environmental database EnviDB
(radiation, air pollution, hydrological and other environmental monitoring). The guarantee of data storage quality is the industry-proven Oracle® Database Server, the world leader in database technologies.


text: At intervals, motivational dream theater metal dt music group picture drawing can help you to break through your bad mood. The brand-new, brilliantly glowing dream theater metal dt music group picture drawing can affect your mood and makes feeling for you to be positive. There are different opt in desktop ilustrations, but you can get each as claimed by your aura and admiration. Suggestion would be to gain picture drawing, ready for low days or terrible afternoons and gain package of feeling boosting desktop ilustrations to have for your mobile telephone? We got amazing amount of super cool, perfect quality desktop ilustrations to set from so you potentially will be inquiring in.

domain: artistic


text:
时间：03-29 来源：转载 浏览量：84157
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壹圖讀懂 | 關于推進國家技術創新中心建設的總體方案（暫行）
'I'm bored,' said Sirius. 'Wish it was full moon.'
'Don't be so ridiculous,' said Hermione, straightening up and looking at him as though she could not believe her eyes. 'With Umbridge groping around in the fires and frisking all the owls?'
'Chocolate in the library!' she screamed. 'Out - out - OUT!' And whipping out her wand, she caused Harry's books, bag and ink bottle to chase him and Ginny from the library, whacking them repeatedly over the head as they ran.
Harry looked around and glimpsed Snape a short way away, moving between the tables towards the doors to the Entrance Hall, still absorbed in his own exam paper. Round-shouldered yet angular, he walked in a twitchy manner that recalled a spider, and his oily hair was jumping about his face.;

domain: library


text:
Physical Exercise Linked to School Performance
The more physical exercise children engage in, the better they perform academically, a new Dutch report says. According to HealthDay News, researchers from Vrije Universiteit Medical Center in Amsterdam reviewed 14 studies on the subject and found that play increases blood and oxygen flow to the brain, which leads to better classroom performance.
“We found strong evidence of a significant positive relationship between physical activity and academic performance,” the researchers said in a journal news release. “The findings of one high-quality intervention study and one high-quality observational study suggest that being more physically active is positively related to improved academic performance in children.”
The researchers, led by Amika Singh at the EMGO Institute for Health and Care Research, reviewed 14 studies from the United States, Canada and South Africa. The studies ranged in size from 50 participants to 12,000, and looked at children from the ages of six to 18, HealthDay said.
In mapping out a reason for the connection, investigators pointed to increased blood and oxygen flow to the brain as well as an increase in the hormones responsible for limiting stress and boosting mood. Physical exercise also works to create new nerve cells and promote synapse flexibility, the Dutch team said.


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April 20, 2023
After years of sounding the alarm over the state of our healthcare system, doctors are still not being listened to by the PC government. New information obtained by the Manitoba NDP shows Premier Stefanson’s Surgical Task Force Working Group does not include a single doctor.
“For years doctors and frontline health care workers have been pleading with the government to listen to them,” said NDP Health Critic Uzoma Asagwara. “Brian Pallister refused and Premier Stefanson is doing the same: she’s leading a surgical task force without any doctors. This information verifies what we’ve heard from doctors who quit the task force because they were tired of being ignored and left out of decision making.”
The Premier’s calendar from December, 2, 2022, shows her biweekly meeting with the “Surgical Task Force Working Group”. The working group members include multiple Ministers and PC staffers. Missing from the meeting, however, were doctors or other healthcare professionals.
You can see the FIPPA document here.


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National Anthem row: The government said an inter-ministerial committee has been set up as the framing of guidelines describing circumstances and occasions on which the national anthem is to be played or sung, and observance of proper decorum on such occasions requires extensive consultations.
National Anthem row: The central government has urged the Supreme Court to reconsider its order of making the National Anthem being mandatory in cinema halls before the screening of films. On Monday, the Centre said that an inter-ministerial committee is being asked to look into the matter, reported the Indian Express. The government has said that it will take a call once the committee submits its recommendations in six months. However, the National Anthem will be played mandatorily in cinema halls until further order.
The government said an inter-ministerial committee has been set up as the framing of guidelines describing circumstances and occasions on which the national anthem is to be played or sung, and observance of proper decorum on such occasions requires extensive consultations. This has been conveyed to the apex court in an affidavit filed by Deepak Kumar, Under Secretary in the Union Home Ministry. The national anthem matter is due for hearing on Tuesday before a bench headed by Chief Justice of India Dipak Misra.
According to the affidavit filed, it says that the court “may consider” restoring the position that existed prior to November 30, 2016 when the cinema halls across the country were asked to play the national anthem before the screening of films and the audience must stand and show respect till the anthem concludes, in a bid to “instil” a “sense of committed patriotism and nationalism” among people. The decision was taken by a bench of Justices Dipak Misra — before his elevation as CJI — and Amitava Roy.
Earlier, in October 2017, the top Court had asked the Centre to consider amending the national flag code for regulating the playing of the National Anthem in cinema halls across the country. A bench, comprising Chief Justice Dipak Misra and Justices A M Khanwilkar and D Y Chandrachud, said the Centre has to take a call uninfluenced by its earlier order on the playing of the national anthem in the theatres. It had said that “love and respect for the motherland is reflected when one shows respect to the national anthem as well as to the national flag.”

domain: news


Omphemetse Sibanda analyses three recent Constitutional Court rulings, writing that it needs to get itself in order, especially if it is to deal with politically sensitive matters going forward.
The South African Constitutional Court has over time received accolades as one of the world leaders in constitutional jurisprudence.
Who can forget the court's 1995 decision in the case of State v Makwanyane on the abolishment of the dreaded death penalty. Also noteworthy is the court's decisions on the findings of the Public Protector's report on Nkandla. It's 2016 Nkandla ruling is considered to have been a significant milestone indicative of a court "fully aware of its own constitutional obligations and that, unlike its apartheid era predecessors that were hamstrung by the supremacy of Parliament" and that "it possesses a mandate to check the abuse of power by other branches of government".


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A Christmas activities advent calendar is a great way to enjoy quality time with your family this holiday! Make your own activity advent calendar using these printables, and then do one family-friendly activity each day leading up to Christmas!
Advent calendars are a family favorite tradition for the Christmas season! But what if your kids are tired of opening the same small pieces of candy or micro-mini dollar store toys in their calendars each year?
Then try filling your advent calendar with experiences instead of “stuff”!
You can make your own DIY advent calendar filled with Christmas activities cards that the whole family can enjoy together… everything from picking out a gift from the Angel Tree to making handmade Christmas cards for teachers to baking Christmas cookies.
And since I know it’s the holidays and you’re probably already SUPER busy doing all the things, I’ve made this Christmas tradition easy for you!
With my printable advent calendar kits, you can create your own DIY Christmas activities advent calendar with some cute advent numbers, activity cards, and mini envelopes!
What is a Christmas Activities Advent Calendar?
Think of a Christmas activities advent calendar as a traditional advent calendar that helps you countdown to Christmas, except instead of opening a small toy or piece of chocolate each day, you’ll open a small envelope with an activity card instead!
The daily activities can be as elaborate or as easy as you like… or you can include a mixture of simple activities that you can do at home, like making S’mores, with activities that take more time, like going to see a Christmas play or show. There are so many different activities that you can add to your advent calendar to make it fun for your family and to fit your budget!
But the best thing about making a DIY advent activities calendar is that it helps you spend more quality time together as a family!
Before diving into the excitement of planning 24 days of Christmas activities, you’ll need to gather some supplies to make your calendar. If you want to make the activities calendars like I have in this post, you will need:
- an open wood frame or wire wall photo grid – You can also use a bulletin board or create an advent calendar garland using ribbon or twine to hang on the wall or mantle. This is the gold photo wall grid that I used in this post.
- mini envelopes – The printable Christmas activities cards are sized perfectly to fit in 2.25″ x 3.5″ mini envelopes. These are the multicolored envelopes that I used.
- mini clothespins or clips – You can find mini clothespins at most craft stores in a variety of colors and styles.
- twine, ribbon, or string
- white card stock
- scissors, paper trimmer, or 2″ circle hole punch – If you’re using the round advent calendar numbers, they fit perfectly in a 2″ circle punch to make assembly super easy!
- the printable advent calendar kit – Available in my SHOP HERE!
DIY Advent Calendar Printable Templates – 3 Different Designs!
Here are examples of all 3 of the Christmas activities advent calendars that you can create with the printable advent calendar kit:
Black and White Ornament DIY Advent Calendar
We colored the outside numbers with colored pencils to create a multi-color advent calendar… but the actual printable template will print out in black and white. If your Christmas decor is more neutral, you can keep the cards black and white instead and use black mini envelopes. The choice is yours!
Blue Snowflake Advent Calendar
I used a combination of blue, white, and tan mini envelopes to create this snowflake themed advent calendar:
Red and Green Christmas Activity Advent Calendar
For a more classic look, try mixing red, lime green, and darker green envelopes for your Christmas activity advent calendar:
How to Make a DIY Advent Calendar with Christmas Activities
Making your own Christmas activities advent calendar is super easy thanks to these cute printable templates! Just follow these steps:
Step 1: Print the advent calendar printables on white card stock.
Decide which of the three designs that you would like to use, and print the pages for that design on white card stock. I prefer using the card stock because the activity cards are nice and sturdy when you take them in and out of the mini envelopes, and the numbers look nicer on the outside of the envelopes.
My printable advent calendar kit comes with three different designs, so you can choose which you like best. These ornament designs actually print in black and white, and you can color them in with colored pencils if you like:
Step 2: Cut out the advent calendar numbers and activity cards.
Next, cut out the advent numbers and activity cards. If you’re using the round numbers, then they fit perfectly in a 2″ circle punch to make this super quick!
For the ornament design, I recommend using a paper trimmer to quickly cut straight lines. Of course, you can also use scissors if you like, but your calendar will take longer to assemble.
Step 3: Assemble the Christmas Activities Advent Calendar
To assemble your Christmas activities advent calendar, first attach the numbers to the outside of the mini envelopes. Then, place one activity card inside each numbered envelope.
I used tape to attach the cut out advent numbers to the fronts of the envelopes, but you can also use a glue stick or a craft tape runner.
Then, just attach the prepared envelopes to the frame or wall photo grid that you’re using as the base for your DIY advent calendar. For the open frame calendar, I simply inserted a push pin into the back of the wood frame, and tied a piece of jute twine around the head of the pin like this to create a “clothesline” of sorts:
Then, just use mini clothespins or other clips to attach the envelopes to the twine or wire grid like this:
Step 4: Hang up your DIY Advent Calendar and enjoy!
Once your calendar is decorated and the activities are ready, hang the activity advent calendar in a central location where everyone can see it. And then you’re all set to embark on a month-long adventure of festive family fun!
Starting on December 1st, open the envelope with the number 1 on it, and do the activity on the card. The great thing about this DIY advent calendar is that you can put the activities in any order that you please, so if you always go for a Christmas lights drive on Christmas Eve (our family does this!), then put that activity card in the envelope labeled “24”.
Advent Calendar Christmas Activity Ideas
Here are the advent calendar activities that are included on the printable cards. There are 27 different cards included in each design, so you can choose the 24 Christmas activities that you like best:
- Take your family Christmas photo
- Visit a holiday market, craft fair, or Christmas festival
- Make magical reindeer food for Santa’s reindeer
- Have a pajama day
- Christmas story time
- Go through kids’ clothes and toys and find items to donate to those in need
- Build a gingerbread house – Or try a 3D paper craft gingerbread house instead!
- Have a Christmas movie night
- Visit Santa
- Purchase a gift from the Angel Tree
- Bake Christmas cookies
- Make handmade cards for community helpers like firemen, police officers, or military members
- Write a letter to Santa – You can use these free printable Santa Letter templates!
- Make a DIY ornament
- Have a family game night
- Have a pizza night
- Go for a drive to look at Christmas lights – You can use this free printable Christmas Lights Scavenger Hunt to make this Christmas activity even more fun!
- Make DIY garlands for the Christmas tree or decor – Like stringing popcorn or making paper chains
- Go purchase one new Christmas ornament each – This is one of our family’s favorite Christmas traditions!
- Decorate the Christmas tree
- Go see a Christmas show, play, or movie
- Make fancy cups of hot cocoa
- Make handmade Christmas cards to give to teachers
- Go through your coats and winter gear to find items to donate to those in need
- Make S’mores
- Make a Christmas music playlist to play on Christmas morning or during your holiday party
- Go on a Christmas scavenger hunt
Get the Printable DIY Advent Calendar Kit HERE
Want to make your own advent calendar with fun Christmas activities to do all month long? You can check out the DIY advent calendar kit in my shop here!
And if you loved this easy Christmas idea, then be sure to check out some of my other Christmas printables:
- Free Printable Christmas Wish List – Choose from 16 different Christmas list templates for your kids to make their lists!
- Christmas Treasure Hunt with Printable Clues – Set up a fun Christmas scavenger hunt for your kids to find their stockings or “big gift” on Christmas morning!
- Santa’s Nice List Certificate – Use this printable to make an official Nice List certificate for your kids!
And don’t forget to PIN this post for later:


text: Determine if the tree was transplanted into its current location recently. Other pine tree species also drop old needles, replacing them with new growth at … of planting, my Dwarf Crimson King Maple is dying bit by bit. Often, this is the work of a borer, according to The University of Kentucky. Measure the diameter of the tree trunk 4 feet up and spread 1 pound of fertilizer per inch of trunk diameter over the soil beneath the tree canopy. There are problems all over the United States with infestations, so the more records we can create, the better it will be. This could be a pest infestation, disease outbreak, old age or a sudden environmental change such as drought, flooding, or extensive root or storm damage. Sometimes, it is just one singular branch that isn’t getting leaves at a similar rate as the rest of them or maybe it is completely dead. Infested branches should be pruned off. A branch (UK: /ˈbrɑːntʃ/ or UK: /ˈbræntʃ/, US: /ˈbræntʃ/) or tree branch (sometimes referred to in botany as a ramus) is a woody structural member connected to but not part of the central trunk of a tree (or sometimes a shrub). Understand that uncharacteristic weather conditions can result in tree problems. Fungal infections cause many pine trees to die. As mentioned, having a fungus is one of the most common reasons why branches die. Some pines, like ponderosa and Scotch, drop needles growing on the lower branches. Leaves that have been infested with insects or diseases will, often, drop early. When conifers die back due to stress, they tend to lose needles from the inside of the crown out and from the bottom up. Here, we’ll go over what causes trees to wither away and explain preventative measures you can take to ensure your tree’s overall health. Like Jim, you may be wondering why your tree is growing this way. There can be a number of reasons. A branch dying is typically in the middle of the death process and sometimes, there is no going back for the rest of the tree. A Great Basin bristlecone pine that recently died in California was 4,845 years old. Other times, it won’t get enough water so it self thins to preserve the healthiest branches. However, there are many trees that die … Each year another 5 to 10 percent of the tree fails to support new growth. The insects do damage to the tree, which over time will cause the tree to die. These are some of the worst types of infestations, so if you think you have a borer problem, you absolutely need to contact a tree care professional. As mentioned, having a fungus is one of the most common reasons why branches die. However, most cankers are small and inconspicuous; thus infections might not be noticed until later in spring when flowers, shoots, and/or young fruit shrivel and blacken. It is a mature tree with whole branches dying off. They are far more common than people think – but not all of them are dangerous. The Causes of Sparse Leaves Your tree may not necessarily be dying. It depends on how you define "sleep," but trees do relax their branches at night, which might be a sign of snoozing, scientists said. Roundheaded or longhorned borers commonly attack diseased or damaged trees that are already dying. Clearly, though, no tree is immortal, and some die … Yellow, brown or droopy leaves could mean: The tree isn’t getting enough water; You may find that the tree doesn't have the necessary nutrients for survival. Canker disease will cause foliage on affected branches to wilt and turn yellow or brown. There is no job too big or too small – contact our professionals today! The ooze turns dark after exposure to air, leaving streaks on branches or trunks. Leaves and branches of holly can be affected by extremes in cold, heat and wind. Look for brown spots, chewed holes or other insect damage on the tree. I have been noticing a problem with my silver maple for several years now. Damage to the vascular system causes wilting and branch dieback in the tops of the trees or at branch tips inward. Unless the wall 4 step has succeeded just in the nick of time, the tree will soon die. For example, an early freeze, late freeze or drought conditions can result in dying leaves and branches on some trees. Branches infested with beetles should be pruned off and burned immediately to keep the beetles from infesting other trees. Prevent dead needles on lower pine branches by preventing water stress. Bag the dead branch tips and throw them out with the trash. Dieback is a progressive death of fruit tree branches and twigs caused by various diseases. To submit your questions or ideas, or to simply learn more, see our about us page: link below. Water the tree every 10 days when it does not rain. The tree grow back the branches...somewhat, but I was wondering why do people cut the trees like this? Below we explore causes and solutions for trees not leafing out. I was so sad seeing the new shape of my The eggs hatch and the larvae burrow their way into the ground to start the cycle all over again. Remember that planting trees is a delicate art and requires a practiced hand, as does caring for those trees. Is that a cause for concern?? Common reasons new trees or shrubs fail It would be wonderful if every new plant we bought thrived. If you need help, always reach out to a professional. Sometimes if a tree doesn't receive enough moisture after transplanting, it can die or exhibit problems. Then in June the top died ,I had the same tree service come and remove all of the dead lead branches. A tree can also eventually choke and die. 1. If you believe that you have a problem with your trees or in your yard, give us a call today at (269) 216-6811 and we can set up a time to visit you and your beautiful trees to see just what the problem is – and how we can help you. Check for entry and exit holes in the branches and trunk. Trees can live for a very long time. Roundheaded or longhorned borers commonly attack diseased or damaged trees that are already dying. This is particularly true when you plant trees in your yard that do not belong in a specific area. Canker disease will cause foliage on affected branches to wilt and turn yellow or brown. The inner branches of all trees will decline and die as the tree matures. They are far more common than people think – … However, sometimes trees will self thin when they are stressed and there aren’t enough resources to go around. I’m telling you this because if you want to save your tree, now is the time and you will need someone who can: 1) access the tips, and 2) knows what and where to prune the branches once he gets there. In the forest, where competition for light is fierce, most trees will lose their lower branches over time when insufficient light is available to maintain them. Pruning for plant health focuses on removing dead, dying and diseased branches, branches that rub together and any branch stubs so the entire tree continues to grow in a healthy way. Perform a soil test of the soil surrounding the tree. A fungus is different than an infestation because a fungus may look like it has gone away, but it could still linger. Below we explore causes and solutions for trees not leafing out. Affected leaves and branches may die, but damage is usually isolated and does not affect the whole tree. I would be cautious about "limbing up" a tree too early. Get back to enjoying your dreamy palm trees with this advice on restoring a droopy, brown tree.

domain: biology


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FLATLAND...A Fourth View (Science Fiction and Articles)
Time for a final discussion of my old favorite FLATLAND: A Romance of Many Dimensions (1884) by Edwin Abbott....
Our focus now shifts to the science fiction side of the fourth dimension, with the most famous examples being Madeleine L'Engle's child's book A Wrinkle in Time (1963) and Robert Heinlein's short story And He Built a Crooked House (1940), now available in an on-line version. Some other web site reviews of explorations of the fourth dimension ala science fiction are:
The above references are only starting points; I constantly am finding new science fiction relating to the fourth dimension. Two weeks ago while browsing through a musty used bookstore in San Jose (CA), I discovered Gnarl! (2000), a collection of Rudy Rucker's short stories, including the interesting "Message Found in a Copy of Flatland."
Now on to some published articles that explore the mathematics surorunding the fourth dimension. The following are some good references as a starting point:
If only these references and the Internet sites had been available when I was in college, as I did my senior math thesis on Properties of Higher Dimensions!
- Charlotte Mack's "Exploring Three- and Four-Dimensional Space," Mathematics Teacher, October 1995, pp. 572-575plus
- Tom Banchoff's "From Flatland to Hypergraphics: Interacting with Higher Dimensions," Interdisciplinary Science Reviews, Vol. 15, No. 4, 1990, pp. 364-372
- Dean Priest's "Hypercubes, Hyperwindows, and Hyperstars," Mathematics Teacher, October 1977, pp. 606-609
- Boyd Henry's "The Fourth Dimension and beyond...With a Surprise Ending!" Mathematics Teacher, March 1974, pp. 274-279
- Martin Gardner's "Is it Possible to Visualize a Four-Dimensional Figure?" Scientific American, November 1966, pp. 138-143
- Martin Gardner's "Fiction About Life in Two Dimensions," Scientific American, July 1962, pp. 144-152
- R. Jacobson's "Spaceland--As Viewed Informally From the Fourth Dimension," Mathematics Magazine, September 1967, pp. 174-178
- Andrew Watson's "Mathematics of a Fake World," New Scientist, June 2, 1988, pp. 41-45
- Bradley Gorzitza's "Theoretical Properties of the Fourth Dimension," Vector, May 1979, pp. 18-23


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The Golden Triangle Commissioned for the Cooks, the GT features iconic landmarks and regularly visited spots in the Perth Western Suburbs. Painted with acrylics and paint pens, The Golden Triangle is bright and colourful and allows us to familiarise with many memories we have living along Stirling Hwy between the ocean and Swan River….. Freo Harbour,…
Ocean Zone Boardshorts will be having another stall at Cottesloe Village Carnival
We will be located in between the Dome and Elba on Napoleon st
Boardshorts, Artworks and collecting Art Competition entries
Hope you can come down
Summer 2014/15 has arrived!
Featuring new original designs by our young design team
The shorts are available online and in stores now


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The 2012 AMA Pro Flat Track Championship currently consists of 16 confirmed races with three more in final negotiations, according to AMA Pro Racing – so there’s hope that the final schedule will feature 19 rounds.
Of the 16 confirmed events, the Grand National Twins races make up 10 of those (five half miles and five miles) with the 450s currently featured in three TTs and three short tracks. All 16 events will also host the Pro Singles class that showcases the future stars of the sport.
The season starts with the Daytona doubleheader of short tracks, March 15-16 and will conclude in October with the Pomona Half Mile in Southern California.
Following the Daytona doubleheader, the series will move to the Illinois State Fairgrounds for the Memorial Day weekend that features both a TT and the famous mile.
On June 9, the first of the to-be-announced races occupies the schedule ahead of the Lima Half Mile in Ohio. The series then heads to Hagerstown, Maryland for a half mile before stopping in Lake Odessa, Michigan – which returns to the calendar on July 14.
The Sacramento Mile is back for a second year on July 28 in Northern California and then it’s a drive up the coast to the Castle Rock TT in Washington on August 4. The Peoria TT will be held a week later in Illinois – a race that has been on the schedule since 1947.
The Indy Mile will return in 2012 after its last-minute cancellation last year – and again it will run in conjunction with the Red Bull Indy MotoGP on August 18. The race will also be held right in the middle of the Indiana State Fair.
The series returns to Springfield on Labor Day weekend for a short track and mile – September 1-2 – with a return to Knoxville Raceway in Iowa the following weekend.
A to-be-announced race is on the calendar for September 15 and after that comes a second mile race in California – this time a return for the first time since 1970 to the Santa Rosa Mile at the Sonoma County Fairgrounds in Santa Rosa on September 30.
The final to-be-announced event on the schedule is slated for October 6 – the week prior t the season-ender at the LA County Fairplex in Pomona.
The series schedule is as follows:
Round 1: March 15 – Daytona Flat Track I, Daytona Flat Track, Daytona Beach, Florida (Short Track)
Round 2: March 16 – Daytona Flat Track II, Daytona Flat Track, Daytona Beach, Florida (Short Track)
Round 3: May 26 – Springfield TT, â€¨Illinois State Fairgrounds, Springfield, Illinois (TT)
Round 4: May 27 – Springfield Mile, Illinois State Fairgrounds, Springfield, Illinois (Mile)
Round 5: June 9 – TBA
Round 6: June 30 -Lima Half-Mile, Allen County Fairgrounds, Lima, Ohio (Half Mile)
Round 7: July 7 – Hagerstown, Half-Mile, Hagerstown Speedway, Maryland (Half Mile
Round 8 – July 14 – I-96 Half-Mile, I-96 Speedway, Lake Odessa, Michigan (Half Mile)
Round 9: July 28 – Sacramento Mile, Cal Expo, Sacramento, California (Mile)
Round 10: August 4 – Castle Rock TT, Castle Rock Race Park, Castle Rock, Washington (TT)
Round 11: August 12 – Peoria TT, PMC Race Park, Peoria, Illinois (TT)
Round 12: August 18 – Indy Mile, Indiana State Fairground, Indianapolis, Indiana (Mile)
Round 13: September 1 – Springfield Short Track, Illinois State Fairgrounds, Springfield, Illinois (Short Track)
Round 14: September 2 – Springfield Mile II, Illinois State Fairgrounds, Springfield, Illinois (Mile)
Round 15: September 8 – Knoxville Half-Mile, Knoxville Raceway, Knoxville, Iowa (Half Mile)
Round 16: September 15 -TBA
Round 17: September 30 – Santa Rosa Mile, Sonoma County Fairgrounds, Santa Rosa, California (Mile)
Round 18: October 6 – TBA
Round 19: October 13 – Pomona Half Mile, LA County Fairplex, Pomona, California (Half Mile)

domain: geography


text:
60 more test positive for dengue in a week Karachi
KARACHI (92 News) – Sixty more people tested positive for dengue in a week in Karachi on Thursday.
The number of patient during this year has risen to 998.
On the other hand, one more patient tested positive for Congo virus. His condition is stated to be critical.


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Minimal residual disease (MRD) in chronic lymphocytic leukemia (CLL) is defined as <1 CLL cell per 10,000 leukocytes (0.01%; <10−4). Flow cytometry and next-generation sequencing have demonstrated high sensitivity in MRD detection. MRD assessment may help to determine prognosis after fixed-duration regimens; this has been established in the contexts of chemoimmunotherapy and venetoclax/antibody combinations. In the short term, MRD status does not seem to inform prognosis in patients treated with a BTK inhibitor plus venetoclax-based regimens; however, long-term data will be needed to determine whether it is beneficial in this population. Numerous trials have demonstrated that MRD may be used to guide therapy. It is unclear whether using an MRD-guided treatment strategy is better than using fixed-duration therapy; ongoing and future studies are warranted.
Disclosures: Dr. Woyach has disclosed receiving consulting fees from AbbVie, Inc., AstraZeneca Pharmaceuticals LP, BeiGene, Eli Lilly and Company, Janssen Pharmaceutica Products, LP, and Pharmacyclics; receiving grant/research support from AbbVie, Inc., Janssen Pharmaceutica Products, LP, Karyopharm Therapeutics, MorphoSys AG, Pharmacyclics, and Schrodinger; and serving as a scientific advisor for Newave.


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Frey Foundation brings banking/finance expert to Michigan
School of Business Administration
An endowed professorship established by the Frey Foundation at the Business School will go to Anjan Thakor, one of the country's most prominent experts on banking strategy and regulation as well as on key aspects of finance. The new faculty post was established with a $1.2 million grant from the Foundation and will be known as the Edward J. Frey Professorship of Banking and Finance.
The new professorship makes a major contribution to building Michigan's expertise in a vital area and is seen by the School as an important step in furthering the capabilities that have placed it in the top ranks of business schools, according to the School's officials. Thakor's appointment to the Frey Professorship will be recommended to the Regents.
"The University of Michigan played a large role in my father's business career, and his affection for the University was ever-present," says David Frey, vice chairman and trustee of the Frey Foundation. "Being able to honor him by helping further the Business School's national prominence is gratifying and most appropriate.
"We are especially delighted that this chair has enabled Michigan to attract one of the country's leading scholars and teachers in banking and finance, an industry my father helped shape. The Business School's unusual commitment to teaching its students corporate citizenship also makes Michigan a particularly appropriate place for us to establish a professorship in my father's name."
Succeeding his father, John E. Frey (1880_1962), Edward J. Frey Sr. served for 31 years as chief executive officer of Union Bank and Trust Co. (now NBD) and also founded Foremost Insurance Company in Grand Rapids in 1952.
Thakor is currently chairman of the finance department at Indiana University's School of Business, where he is the NBD Professor of Finance. He has expertise in banking policy, regulation, and strategy and also has emerged as a leading thinker in the area known as financial intermediationways of linking sources of capital with businesses and individuals in need of financing. Thakor is an editor of the Journal of Financial Intermediation and recently co-authored a text book on bank management titled Contemporary Financial Intermediation. He is associate editor of four other academic journals and has published more than 50 articles in leading academic journals in finance and economics, as well as numerous other monographs and chapters in books.
"Prof. Thakor brings precisely the kind of accomplishment in research and teaching that was envisioned when this chair was established," says Business School Dean B. Joseph White.


New testing sites to open in Wakefield as district reports third highest rate of cases in the country
Two new mobile Covid testing sites are set to open in Wakefield, as the district reports the third highest rate of Covid cases in the UK.
The seven day rate of cases of Covid-19 in the Wakefield district currently stands at 122.3 per 100,000, compared to a national average of 44 per 100,000.
Wakefield's rate is the third highest of any local authority in the UK, with only Doncaster and Clackmannanshire, in Scotland, are currently reporting higher rates.
A total of 25,051 people in the district have tested positive for Covid-19 to date, including 426 people in the last seven days.
Speaking earlier this year, Anna Hartley, Wakefield's director of public health, said she believed that the high number of manufacturing jobs in West Yorkshire was contributing to high case rates in the county.
As part of an effort to tackle the rising rates, two new mobile testing sites are set to open in the district in the coming days.
The units will offer walk through PCR testing for residents who are displaying symptoms of Covid-19, or are concerned that they may have been in contact someone who has the virus.
No appointments will be necessary at the sites, which will be open from 9am to 3pm.
The sites will move around the district in future weeks, but begin in Normanton and Ossett.
Anna Hartley, Wakefield Council’s Director of Public Health, said: “Easy access to testing is really important to reduce our infection rates in the Wakefield district. Please do take this opportunity to get tested, particularly if you have symptoms.”
The first testing site, at Normanton and Altofts Comrades’ Athletics Club, will be open on Tuesday 6, Friday 9, Tuesday 13 and Friday 16 April.
A second site, at Ossett Market, will be available for walk-in appointments on Wednesday 7, Thursday 8, Saturday 10, Sunday 11, Wednesday 14, Thursday 15, Saturday 17 and Sunday 18 April.
PCR testing sites will remain in place at Wakefield Waterfront and the former Castleford Swimming Baths, while home delivery test kits are also available.
To find out more or request a home testing kit, visit the Wakefield Council website.


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Google Glass Is Creeping Back The tech company is reportedly launching a new version aimed at businesses and without the histrionics that accompanied the product's initial debut.
Opinions expressed by Entrepreneur contributors are their own.
Google is bringing Glass back.
A new version of the wearable computer – which generated polarizing reactions and heavy backlash when it initially launched as a consumer product in 2012 – is being rolled out to businesses, The Wall Street Journal reports.
The updated model will be used by professionals in industries like manufacturing and health care, likely starting this fall. A consumer version won't be released for at least a year, according to the outlet.
This relatively low-key rollout is very different from the splashy approach Google took when it first launched Glass. Back then, to generate awareness for the product, the company created the high-profile Explorer program in which a beta version of the device was handed out to a group of consumers for testing.
The public backlash against the wearable, still a work in progress, was swift and continuous. 'Explorers' ruffled feathers every time they wore the glasses in restaurants, movie theaters and public restrooms. These privacy concerns, plus the host of bugs discovered in the beta version and its lofty $1,500 price tag, meant that Google Glass continued to receive bad press until the company finally pulled the plug on the project last winter.
By marketing the device directly to businesses – where it will be used primarily in private settings – Google appears to be looking to avoid another PR crisis.
The new version of Glass will include a faster Intel processor, a longer battery life and improved wireless connectivity in addition to some subtle design changes, the WSJ reports.


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Come Lift Your Voice With Us!
Audition Information: 2015-2016 Season
Dates: September 14, 21, 28 (other dates by arrangement)
Times: To be arranged (see below)
Place: Union Baptist Church
119 High Street
The celebrated Mystic River Chorale is holding auditions for the upcoming Winter and Spring 2015-2016 season, featuring Faure's Requiem and Phillip's Dies Gratiae: Requiem Reflections for its Winter concert.
The Mystic River Chorale welcomes singers from throughout the Southeastern CT area. Auditions comprise a straightforward and non-threatening evaluation of musicality, voice quality, range, and music literacy. New singers should prepare a song they feel flatters their voice; popular choices include "Amazing Grace," "America the Beautiful", hymns, carols, or folk songs, in addition to theater songs or arias. Please bring an extra copy of your selection for our pianist.
Individuals interested in auditioning should e-mail the Chorus Manager to obtain an audition time or call (860) 460-1487 for additional information. Further information is available at www.mysticriverchorale.org
This item was posted by a community contributor. To read more about community contributors, click here.


|Publication number||US5516028 A|
|Application number||US 08/337,192|
|Publication date||May 14, 1996|
|Filing date||Nov 7, 1994|
|Priority date||Nov 10, 1993|
|Also published as||DE4338445A1, EP0652697A1|
|Publication number||08337192, 337192, US 5516028 A, US 5516028A, US-A-5516028, US5516028 A, US5516028A|
|Inventors||Richard A. Rasp, Bernd Johannsen|
|Original Assignee||Rasp; Richard A., Johannsen; Bernd|
|Export Citation||BiBTeX, EndNote, RefMan|
|Patent Citations (11), Non-Patent Citations (4), Referenced by (53), Classifications (10), Legal Events (6)|
|External Links: USPTO, USPTO Assignment, Espacenet|
1. Field of the Invention
This invention relates to a process and system for temperature control and in-line testing of electronic, electromechanical or mechanical modules with the components fitted as semi-finished products, in particular printed circuit boards, which leave in succession a soldering station and, following temperature control in a test phase, are connected electrically or optically to at least one electric or optic testing device by means of an adapter unit and are tested by means of the testing device.
2. Discussion of Background
A system for handling and testing printed circuit boards with the electric or electronic components fitted is known from U.S. Pat. No. 4,818,933, where the printed circuit boards are tested in devices with respect to the correct positioning and orientation of the components fitted and with respect to the function prior to their final installation. The system exhibits a supporting frame, which contains at least one adapter plate for contacting printed circuit board contacts, and orientation devices and locking devices and conveyor for feeding in and carrying away the printed circuit boards to be tested. The essential feature in this system is that, during the testing process, the next printed circuit board can already be fed in and stopped.
Furthermore, an integrated printed circuit board testing system is described in the U.S. Pat. No. 5,055,779, where the conversion of a conventional vacuum test system into a mechanical test system is described. The use of such test systems for testing printed circuit boards at high temperatures or low temperatures has been demonstrated to be a problem, since the appropriate test electronics is attached directly to the adapter in order to scan the test points on the pc boards, and an ambient temperature of 100° C., as required for a high temperature test for printed circuit boards, would also increase, for example, the operating temperature of the test equipment and thus possibly impair its proper operation.
A test console with a chamber, in which test pc boards for electronic components are arranged, is known from the DE-GM 83 04 116. In the test chamber it is determined whether or not the test pc board fails under the specified test conditions, such as temperature; if special sealing measures for the test chambers are used, a plurality of electric contacts between the selected pc board of the test device and the test pc boards is to be produced in a minimum of space within the console.
Furthermore, test equipment including a furnace chamber for testing electric components arranged on printed circuit boards is known from the DE-PS 37 21 653, wherein the walls, floor or cover have one slot or multiple slots with temperature resistant sealing lips that are attached to both sides of the longitudinal sides of the slot and through which parts of the supporting plates can be pushed. The sealing lips are formed by two sluice-shaped sealing profiles of a cross section that is, for example, U-shaped, where the profiles rest flat in the center of the slot.
Furthermore, a device for testing single electronic components, such as integrated circuits, is known from U.S. Pat. No. 4,607,220, wherein the-test conditions are conducted in a wide temperature range of -65° to +150° C., for example.
The problem with the known temperature control and test equipment has proven to be the batch loading of the furnaces or consoles or test equipment, so that a function test is not possible between the production steps or temperature control phases; and the final test of the modules cannot take place until said modules are finished; i.e., complete assembly with their external connecting configuration.
Accordingly, the objects of this invention are to provide a novel method and system for temperature control and testing of electronic, electromechanical or mechanical modules, with component elements fitted as semi-finished products, in particular printed circuit boards, wherein the printed circuit boards are subjected to at least one test phase at high and/or at low temperature, for example, by means of an in-circuit tester (ICT) or a functional tester, in a range of -50° to 200° C., immediately following a soldering process as the printed circuit boards emerge from the soldering station, and wherein determined module defects immediately trigger correction measures, thereby to eliminate quickly systemic errors in the preceding production steps so that large numbers of defective modules can be avoided and so that the supplied energy shall be optimally utilized. In one embodiment, the number of defective printed circuit boards in a defined time interval is determined, and when the number exceeds a set number, temperature testing is suspended and corrective measures are taken in the processing stations upstream of the testing station, such as in a printer, a pick-and-place machine and a soldering station. In this way the present invention avoids producing of additional defective printed circuit boards until the source of the defect is located and corrected.
Furthermore, the present invention permits the use of computer directed process controlled production facilities, so that extensive automation of the production and temperature control/test process of the electronic printed circuit boards can be obtained. Moreover, owing to the thermal stresses conducted between the individual production steps, the production steps, preceding the respective function test are checked for their parameters that are effective for the reliability with a subsequent function test, so that a fast correction of the production parameters and thus a lower failure rate of semi-finished products can be obtained.
One important advantage of the invention lies in the fact that owing to the fast recognition of defective production steps, a continuous optimization of the individual components or the entire production sequence is possible, thus enabling an immediate sorting out of defective modules with subsequent repair. In addition it has proven to be advantageous to control the known errors or too high error tolerances for optimizing the parameters of the preceding production steps, whereby, for example, open soldering points or defective orientations of the components can be remedied by refeeding a defective semi-finished product.
In an advantageous embodiment the system of the present invention is constructed in modules, so that the individual modules can be rapidly interchanged or replaced. In another embodiment it is possible to divide the conveyor into device modules or individual modules with individual drive.
The modular construction of the system according to the invention has proven to be advantageous, since the production process can be divided into multiple single steps, with the result that energy can be saved owing to the functional interaction of the modules, which are in themselves separated, within a closed system.
Another advantage lies in the fact that a process sequence, which is predetermined schematically, can be modified in a simple manner by removing individual modules from the modularly constructed system and exchanging or replacing with other modules. The ease with which the system can be serviced is dramatically improved by the easy accessibility of the individual modules; thus, the maintainability of the device is facilitated.
Another advantage lies in the automatability through use of coded modules and decoders within the system, since in this manner a relatively straight-forward management of the modules and automatable quality control is possible with the aid of a central computer and a traceability with respect to quality standard (ISO 9000) is a given. Dedicated coding for each printed circuit board facilitates keeping track of the test history of each printed circuit board so that if a printed circuit board fails a predetermined number of tests, it is then scrapped without further attempts at repair.
Another advantage lies in the fact that after the printed circuit boards leave the soldering device in the first test phase, they can always be maintained and used with all components at the same temperature level by means of convection of heat from the printed circuit boards themselves, which already are at a high temperature as they emerge from the soldering station. Thus energy consumption for temperature testing is reduced.
Another advantage can be seen in the fact that the conveyance of modules can be operated with continuous or clocked movement by means of a modular conveyor or also in combination optionally with additional acceleration, in order to avoid no-load movements for the sake of saving energy and to increase the reliability; in addition, the passage time of the modules is reduced.
Furthermore, it is possible to provide by means of a central computer an automatable change in width and optionally a central support of the transport frame, so that a flexible production program of differently formatted modules or printed circuit boards can travel through the system according to the invention.
A more complete appreciation of the invention and many of the attendant advantages thereof will be readily obtained as the same becomes better understood by reference to the following detailed description when considered in connection with the accompanying drawings, wherein:
FIG. 1a is a diagrammatic top view of the device according to the invention together with a preceding assembly device and soldering station, both of which are shown symbolically, whereas FIG. 1b depicts the temperature profile of the module according to FIG. 1a along the axis of conveyance X.
FIG. 2 is a flow diagram of the sequence control for a module guided thorough the system.
FIG. 3a is a fragmented top view of the system, suitable for modules or printed circuit boards whose width can be adjusted.
FIG. 3b is a diagrammatic front view of the system according to FIG. 3a, wherein FIGS. 3c to 3f reproduce respective sections at different points according to FIG. 3b.
FIGS. 4a and 4b respectively are a longitudinal sectional view and cross sectional view of a test area with tester and appropriate adapter.
FIG. 5 depicts sections of an adapter, whose interfacing/contacting elements are provided for contacting above and below the module.
Referring now to the drawings, wherein like reference numerals designate identical or corresponding parts throughout the several views, and more particularly to FIGS. 1a and 1b thereof, according to FIGS. 1a and 1b, the printed circuit board, shown schematically here as module 1, leaves the symbolically illustrated pick-and-place machine 2 along the conveying direction X and is fed subsequently to the soldering station 3, which is also illustrated symbolically and in which, according to FIG. 1b, the temperature is raised to a value as far as exceeding 240° C., in order to obtain proper soldering of the printed circuit board as a module to the components fitted. After leaving the soldering station 3, the printed circuit board 1 passes through a temperature control area 4 where the temperature of the printed circuit board 1 is reduced to a range between 70° to 125° C. The printed circuit board leaves the temperature control area 4 through the closable gate 5 and enters by means of the conveyor 6 and by way of buffer region 7 the first test area 8. The buffer region 7 serves to uncouple between the soldering station and the entry region of the first test area 8, whereby printed circuit boards that may or may not have been repaired can also be fed in via the buffer region for the purpose of going through the testing process. The test area 8 and the preceding buffer region 7 contain an atmosphere in the nominal temperature range of +70° to +125° C. This atmosphere is protected from external atmosphere by means of a thermal insulation. Preferably the internal atmosphere of the first test area 8 consists of air, whereby the temperature of the modules under test can be adjusted in a set point range of +60° to +130° C. to be specified as desired. However, it is also possible to use inert gas, i.e., nitrogen, for example. The first test area 8 is sealed with respect to heat and atmosphere at least to a high degree from the environment. The test area 8 is shaped like a continuous tunnel, where to carry the modules away from the buffer region 7 into the first test station 9 a fast running conveyor belt element 10 of the conveyor 6 is provided. The conveyor 6 is divided into device modules, which in turn can be subdivided into individual modules, for example, into conveyor belt elements. The conveying movement can be operated either continuously, in switched mode or combined optionally with continuous acceleration. The region of the conveyor belt element 10 has a position sensing system 73 and a scanning system 17, which serves to identify, log and sense the position of the modules that are fed in and which in turn are provided with a scannable code. Another fast conveyor belt element 11 is provided for conveying the modules away from the first test station 9 into a second test station 12. To convey the modules out of the test station 12, there is another conveyor belt element 13, which serves to carry the modules from the first test area 8 through the gate 14. A second buffer region 15, which is connected to the ambient atmosphere and thus serves to cool the modules upon leaving the first test area 8, follows the gate 14.
As in the region of the first conveyor belt element 10, the region of the conveyor belt element 16 that follows gate 14 has a scanning system 18, in order to control the module, following testing in the test area 8 for the purpose of further processing as a function of the test results. The recording and control processes are conducted in a central computer, which is connected to the scanning systems and the test devices and the controllers for the conveyor 6 and for the gates. The second buffer region 15 has, next to the conveyor 6 running in the X-direction, a sluice conveyor 19, which extends perpendicularly to the conveyor 6 and which sorts out via gate 20 defective modules, which are denoted here symbolically with reference number 21, from the second buffer region 15 in the Y direction for the purpose of removal.
The modules 22 that are determined to be faultless are carried away by means of a conveyor 6 via gate 23 into the second test area 74, which serves to test the modules at low temperature and is extensively insulated with respect to heat against the external atmosphere, just like the first test area. Following gate 23 is a conveyor belt element 24, which is divided into a fast, a slow and a fast running segment, whereby the region of the conveyor belt 24 has a dry air or dry gas inlet 26, through which any moisture of condensation can be removed from the modules. Following the conveyor belt element is the third test station 27, which, just like the test stations of the first test area, is equipped with an adapter for contacting the module to be tested. Following test station 27 is another conveyor belt element 28 of the conveyor 6, which guides the module in the conveying direction X to the gate 29, which defines the second test area 74 and from where, after passing the opened gate 29, it is guided into a sluice area 31, which is also provided with a dry air or dry gas inlet 32. After passing through the sluice area 31, the module is guided by means of conveyor belt element 33 through gate 34 into a recover-to-ambient section, and on into a heating and/or dispensing device 35, on whose end 36 there is another scanning system 37, which conveys the modules determined to be faultless in the X direction for further processing, whereas the modules detected as defective are sorted out in the Y direction.
The temperature profile according to FIG. 1b is explained in the following with reference to the specification that defines the functions. The temperature profile is divided into temperature intervals A, B, C, D, E, F, G and H in accordance with the conveying direction X of FIG. 1a.
According to FIG. 1b, interval A represents the temperature in the pick-and-place machine 2, depicted only schematically according to FIG. 1a, whereas the adjacent temperature increase in interval B reproduces the temperature curve along the conveying direction, i.e. the X-axis in the reflow soldering station 3, shown schematically. Upon leaving the soldering station, the module, provided here schematically with reference numeral 1, passes through the cooling area 4, in which the temperature according to interval C drops from about 240° C. to 125° C., so that, when the module 1 enters into the first test station 9 through gate 5, the module 1 brings with it a relatively high temperature level with respect to the environment, so that only a small supply of energy is required for control purposes within the buffer region 7 and the adjoining first test area 8. Within the thermally insulated area formed by means of the buffer region 7 and first test area 8 the desired temperature value can be set in the range of 25° to 200° C.--preferably from +60° to + 130° C. At the same time it is possible to feed inert gas, for example nitrogen, to this temperature control region formed by the buffer station and the test area, in order to prevent with certainty the module or the components fitted or their contacts from corroding. Upon leaving the buffer region 7, the module passes by means of conveyor belt element 10 through the scanning system 17, which logs the type and job number of the incoming module by means of a code found on the module and allocates the test result(s) to be expected to the corresponding job number. In the first test station 9 the module is subjected to a component or in-circuit test, whereby the individual components fitted and the conducting tracks of the module are tested.
Following completion of the incircuit test, the test result is assigned to the decoded job number, whereby a defective module is guided by means of the conveyor belt elements 11 and 13 without further testing from the test area 8 into the second buffer region 15 for the purpose of sorting out, whereas a module that has proven to be faultless is guided by means of the conveyor belt element 11 of the second test station 12 in order to conduct a function test of the entire printed circuit board. A module that is determined to be defective is in turn fed to the buffer region 15 via a conveyor belt element 13 and gate 14 for the purpose of sorting out of the buffer region 15, where the sorting out signal is assigned to the job number forwarded to the decoder 18 of the buffer region, and the defective module leaves the buffer region 15 for the purpose of sorting out at right angles to the conveying direction. A module that is recognized to be faultless is cooled to room temperature, according to the temperature profile of interval E, after passing through the decoder 18 in the buffer region 15, whereby a module that is found to be faultless is fed via gate 23 and conveyor belt element 24 to the third test station 27 for further function testing. The corresponding temperature curve with the drop from approximately 100° to approximately--40° C. and maintenance is shown in the intervals E and F. Upon leaving the test station 27, the module is conveyed by means of the conveyor belt element 28 through gate 29 from the second test area into the sluicing area 31, whereby the module conveyed on the conveyor belt element 33 is heated by means of dry air or gas inlet, whereby according to interval G of FIG. 1b the temperature rises above room temperature to approximately 40° C., and this temperature state is maintained in the heat treating phase of the recover to ambient section 41, until all of the moisture or moisture of condensation has evaporated. This interval is marked with the letter H in FIG. 1b. Upon leaving the recover-to-ambient section 41, the module is carried away in the X direction of the dispenser conveyor element 42 and detected by means of the decoder 43. If the modules are found to be faultless, they are carried away into the next production step or storage. If, however, a module is defective, the module found to be defective is sorted out of the dispenser 46 in the Y direction, with the result that it is carried away, for example by a sluice conveyor, as previously explained in regard to the buffer region 7 or buffer region 15.
FIG. 2 depicts a flow diagram of the sequence control of the module in the process according to the invention, whereby the process steps V1-V3, such as laser labeling, screen printing and SMD pick and place do not belong to the actual subject matter of the process, but are incorporated for the sake of better comprehension.
According to FIG. 2, the modules with, for example, an aluminum plate or ceramic plate on the back side are identified through laser labeling, where, for example, an optical readable bar code is also-applied, in order to enable by means of a computer system a clear allocation of the module through optical scanning and its monitoring and/or recording. Furthermore, the configurations of the contact fields and conducting tracks in the process step V2 are applied, for example, by the screen printing method; and in the process step V3 the module is assembled with electronic, electromechanical or mechanical components. In the process step V4 the components fitted are connected electrically and mechanically through soldering, for example, in the soldering station, where subsequently in the process step 5 the temperature of the printed circuit board is controlled by heating or cooling, in order to maintain a specified test temperature.
Then in the process step V6 the fed-in module is optically scanned by means of bar code scanning, whereas in the process step V7 a high temperature component or in-circuit testing corresponding to the tests performed in the first test station 9 takes place; and in the process step V8 a high temperature function test corresponding to testing performed in the second test station 12 follows. The test results found in the process steps V7 or V8 are assigned to the module coding, which is determined and stored in step V6, whereby a poor test result determined in steps V7 or V8 results in the coded number, determined beforehand in step V6 being covered with the symbol "defective"; and after determining its coding in process step V9, the module is fed in accordance with the test result in process step V10 to process step V11 for the purpose of sorting out, or if the test result is in order, it is fed to process step V12 for the purpose of cooling, followed by a subsequent cold temperature test corresponding to the test performed in the third test station 27 in process step V13. Then in process step 14 the module is carried away via a sluice. In process step V15 the module is heated up again in order to allow, following the cooling process, the moisture of condensation to evaporate. In process step V16 the coding of the module is read out again and the module number is allocated to the test result of the cold test determined in the process step V13. In the process step V17 the decision is made whether the module should be sorted out as defective owing to a module defect in process step 18 or dispensed as a properly tested module for further processing or such as PCB cutting by a PCB cutting machine in step V19 or PCB magazining in step V20.
FIG. 3a shows the modular construction of the device, where for the sake of a better overview the individual stations constructed in modules are provided throughout with the labels S1 to S14. Elements of the device that have already been explained with reference to FIG. 1a are provided additionally with the reference numerals known from said FIG. 1a.
According to FIG. 3a, the modules travel, after leaving the soldering station S1, into the first temperature control area 4, comprising the separating-station S2, the buffer station S3, the scanning station S4, the first test station S5 and the reserved segment S6 for setting the switches in order to sort out defective modules S6 and the second test station S7. As explained above, the temperature in this first temperature control area can be set in a range between 25° to 200° C.
Upon leaving the station S7, all of the modules travel into an unregulated temperature region, where defective modules are sorted out of the testing process via the sorting out station S8, whereas modules tested as faultless are fed to the temperature control area with the cold profile unit S9. In this second temperature control area the modules are adjusted to a specified temperature ranging from -50° to +25° C. At the same time they are fed to the third testing station (inline test) S10 along the direction denoted as X and leave the second temperature control area via the sluice station S11, which is designed as a cold-hot-sluice and enter an uncontrolled temperature region. To prevent the formation of condensation water at room temperature and bring the modules back to room temperature, the modules are fed, moreover, to a third temperature control area with the station heat-profile S12, where the modules that are determined to be defective are sorted out of the path leading to the dispenser S14 via the second sorting out station S13.
According to the top view in FIG. 3a, it is also possible to process modules of different formats, whereby the variable width and center support of the module is done through automatic or manual adjustment of the chain drives or belt drives. According to FIG. 3a, the right sided belt or chain drives are mounted stationarily, as seen in the conveying direction X, whereas the left sided chain drive or belt drive elements and optionally a center support for the modules can be adjusted in the direction of the Y axis, which is plotted symbolically. With the aid of FIG. 3a, the buffer region 7 can be identified, as explained above with reference to FIG. 1, that forms together with the first buffer area 8 an insulated system that is largely sealed with respect to heat and optionally atmosphere against the environment. The modules that emerge from the soldering station enter, following a cooling phase, through gate 5 the buffer region 7, which forms together with the first test area a closed thermal system, where upon leaving the buffer region 7, the modules pass through a scanning system in order to determine and log the respective printed circuit board and then pass through the first test station 9 for the purpose of component testing and the second test station 12 for the purpose of function testing. The test results are allocated, as stated above, to the determined module numbers, whereby the defective modules are fed, upon leaving the first test area through gate 14, to the second buffer region 15, whereby the test results obtained in the test stations 9 and 12 are allocated to the respective module numbers; and the defective modules are sorted out in the second buffer region 15. The modules that are not defective are fed in the conveying direction X to the second test area with the third test station 27, whereby this station is thermally sealed against the environment for the purpose of cold testing and the modules can be fed to it only via gate 29 or carried away via gate 34.
According to the device described in FIG. 3a, it is also possible to decode the module formats in the scanning system and to adjust the width of the modules by means of a central computer and final controlling element in order to adjust the width of the conveyor belts or conveyor chains and optionally support the center automatically or manually, provided the formatting of the modules can be recognized from the coding.
FIG. 3b is a profile section of the module conveying level 48 and the associated buffer regions and test stations along the conveying direction X. Furthermore, FIG. 3b shows the sections I--I, II--II, III--III and IV--IV, which are respectively depicted in the sectional FIGS. 3c, 3d, 3e and 3f. It is apparent from FIG. 3c that the module 45 is in a magazine 47, whose right side edge rests on the right conveyor chain or the right conveyor belt, whereas the left part of the module is situated in a magazine 47 on a conveyor chain or conveyor belt having variable adjustment in the Y direction. The feeding in or carrying away of defective modules is shown symbolically by means of module 44. The upper portion of FIG. 3c shows the empty magazines 47, which receive the next modules if there is a malfunction. FIG. 3d shows one possible configuration of the modules 45 in the second buffer region with possibility of sorting out defective modules, whereas FIG. 3e is a diagrammatic cross sectional view of the module arrangement with module or magazine cycling for the purpose of achieving the temperature in the region of the second test area 74.
FIG. 3f is a cross sectional view similar to that of FIG. 3d of a possible arrangement of modules with the possibility of sorting out defective modules.
FIG. 4a is a longitudinal view along the X axis of the test station, whereas FIG. 4b is a cross sectional view along the Y axis, from which the adjustability of the module adapter relative to the width of the plate is apparent.
According to FIG. 4a, the modules 45 are fed by means of the conveyor belt element 10 to the test station, where the module 45 is contacted by an upper adapter 52 and a bottom adapter 51, both of which are arranged in one of the thermally insulated first or second test areas. The bottom adapter 51 is electrically and mechanically connected to the first testing device 49 by way of a thermal barrier 68 (shown in FIG. 5) or thermal transfer interface, so that the thermal insulation of the atmospheric region, formed by the buffer region and the first test area, is largely sealed against the exterior environment. The upper adapter 52, which is situated above the module 45, is also conveyed, with the exception of its thermally insulated passage 50, through the insulating layer 55 to the first test area.
FIG. 4b is a cross sectional view of a corresponding construction, where the width adjustment required for different module formats is also taken into consideration. According to FIG. 4b, both the left section 53 with its conveyor belt or conveyor chain can be adjusted in the Y direction, whereas the right section 54 of the conveyor belt or conveyor chain is installed stationarily. The construction and mode of operation of the adapters 51 and 52 correspond in essence to the arrangements known from the literature, as described, for example in U.S. Pat. No. 4,818,933. However, one special feature lies in the fact that owing to the thermal insulation of the first and second test area the bottom adapter 51 is also extensively insulated with respect to heat, due to the thermal barrier, from the testing device 49 operating at room temperature. The construction of such thermal barriers is explained in detail with reference to the adapter, as shown by means of the extractions in FIG. 5.
According to FIG. 5, the bottom adapter 51 is provided with receiving sockets 56, which are arranged in the shape of a grid and in which are arranged at least some contact elements 57, which are connected electrically to the test pins 58, which are guided through the electrically insulating bottom adapter plate 59. A corresponding test pin configuration can also be arranged in the upper adapter 52, whereby the test pin 60 of the upper adapter is guided through the bottom adapter plate 61 of the upper adapter. The electrical connection is transferred to the upper test pins 60 via contact elements 57, their connection 63 to the transfer test pin 62 and a wire connection 64 to the test pin 60. The contact positions of the module 45 with the positions of the test pins is allocated exactly with the aid of an adjusting pin 66, which reaches into a recess 67 of the module 45. This device is known in principle from U.S. Pat. No. 4,818,933, so that further explanations concerning the adapter and the module are unnecessary. However, it is essential with respect to the high temperature testing in the first test area or the low temperature testing in the second test area that it is possible to thermally uncouple the adapters, which can be thermally stressed and are situated in the respective test area region, and the respective testing device 49. To this end, there is a thermal barrier 68, which is arranged between the grid plate 67 of the bottom adapter 51 and a grid plate situated above the testing device 49 and which is made of a thermally insulating material and enables a small passage of heat on account of adequate space between test station and adapter. The grid plate 67 is attached to the testing device by means of the pins 69, which project beyond the thermal barrier 68 and which are connected via flexible conductors or wires 70 to the receiving sockets 71 of a bottom grid plate, which defines the thermal barrier and into which project the pins 72 that project beyond the test station for the purpose of contact.
Thus, it is guaranteed that a test station functioning in the room temperature range, as known, for example, from U.S. Pat. No. 4,818,933, can also be used for the subject matter of the invention with few modifications for the purpose of erecting a thermal barrier.
Obviously, numerous modifications and variations of the present invention are possible in light of the above teachings. It is therefore to be understood that within the scope of the appended claims, the invention may be practiced otherwise than as specifically described herein.
|Cited Patent||Filing date||Publication date||Applicant||Title|
|US4607220 *||May 7, 1984||Aug 19, 1986||The Micromanipulator Co., Inc.||Method and apparatus for low temperature testing of electronic components|
|US4818933 *||Oct 8, 1986||Apr 4, 1989||Hewlett-Packard Company||Board fixturing system|
|US4926118 *||Feb 22, 1988||May 15, 1990||Sym-Tek Systems, Inc.||Test station|
|US4993136 *||Jun 19, 1989||Feb 19, 1991||Hewlett-Packard Company||Method of converting a vacuum test fixture on a board testing apparatus to a mechanical test fixture|
|US5055779 *||Jul 9, 1990||Oct 8, 1991||Hewlett-Packard Company||Integrated board testing system|
|US5246291 *||Jun 1, 1992||Sep 21, 1993||Motorola, Inc.||Bond inspection technique for a semiconductor chip|
|US5321885 *||Mar 11, 1992||Jun 21, 1994||Fujitsu Limited||Method and apparatus for manufacturing printed wiring boards|
|US5325582 *||Oct 19, 1992||Jul 5, 1994||Trw Inc.||Multi-function workstation for assembly and repair of printed wiring board assemblies|
|*||DE3721653A||Title not available|
|DE8304116U1 *||W.C. Heraeus Gmbh, 6450 Hanau, De||Title not available|
|EP0164563A1 *||May 6, 1985||Dec 18, 1985||Siemens Aktiengesellschaft||Method of making flat component assemblies|
|1||IBM Technical Disclosure Bulletin, vol. 34, No. 7B, Dec. 1991, "Guardbanding Card Assemblies Within the Manufacturing Line", pp. 343-344.|
|2||*||IBM Technical Disclosure Bulletin, vol. 34, No. 7B, Dec. 1991, Guardbanding Card Assemblies Within the Manufacturing Line , pp. 343 344.|
|3||Test & Measurement World, vol. 14, No. 5, Apr. 1994, p. 93, "Environmental Test Equipment System Makes Continuous Process of Environmental Screening".|
|4||*||Test & Measurement World, vol. 14, No. 5, Apr. 1994, p. 93, Environmental Test Equipment System Makes Continuous Process of Environmental Screening .|
|Citing Patent||Filing date||Publication date||Applicant||Title|
|US5744975 *||Jun 6, 1996||Apr 28, 1998||International Business Machines Corporation||Enhanced defect elimination process for electronic assemblies via application of sequentially combined multiple stress processes|
|US5927512 *||Jan 17, 1997||Jul 27, 1999||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6016947 *||Oct 21, 1997||Jan 25, 2000||International Business Machines Corporation||Non-destructive low melt test for off-composition solder|
|US6066822 *||Jul 29, 1996||May 23, 2000||Advantest Corporation||Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus|
|US6100486 *||Aug 13, 1998||Aug 8, 2000||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6111246 *||Apr 4, 1997||Aug 29, 2000||Advantest Corporation||Semiconductor device testing apparatus having presence or absence detectors issuing an alarm when an error occurs|
|US6147316 *||Aug 13, 1998||Nov 14, 2000||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6307171||Aug 31, 2000||Oct 23, 2001||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6350959||Mar 7, 2000||Feb 26, 2002||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6365860||Nov 16, 2000||Apr 2, 2002||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6365861||Nov 15, 2000||Apr 2, 2002||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6373011||Aug 28, 2001||Apr 16, 2002||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6433294||Feb 16, 2000||Aug 13, 2002||Advantest Corporation||Semiconductor device testing apparatus and semiconductor device testing system having a plurality of semiconductor device testing apparatus|
|US6437271||Aug 30, 2001||Aug 20, 2002||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6504123||Aug 28, 2001||Jan 7, 2003||Micron Technology, Inc.||Process for sorting integrated circuit devices|
|US6564165 *||Dec 22, 1999||May 13, 2003||Trw Inc.||Apparatus and method for inline testing of electrical components|
|US6703573||Aug 23, 2002||Mar 9, 2004||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US6944567||Jun 19, 2003||Sep 13, 2005||Micron Technology, Inc.||Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture|
|US7107117||Mar 2, 2004||Sep 12, 2006||Micron Technology, Inc.||Sorting a group of integrated circuit devices for those devices requiring special testing|
|US7117063||Sep 29, 2005||Oct 3, 2006||Micro Technology, Inc.||Sorting a group of integrated circuit devices for those devices requiring special testing|
|US7120287||Jul 7, 2003||Oct 10, 2006||Micron Technology, Inc.||Non-lot based method for assembling integrated circuit devices|
|US7120513||Aug 31, 2000||Oct 10, 2006||Micron Technology, Inc.||Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICS will undergo, such as additional repairs|
|US7124050||Jun 10, 2005||Oct 17, 2006||Micron Technology, Inc.||Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture|
|US7155300||Mar 27, 2003||Dec 26, 2006||Micron Technology, Inc.||Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs|
|US7276672||Apr 8, 2005||Oct 2, 2007||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US7368678||Aug 13, 2002||May 6, 2008||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US7446277||Mar 6, 2002||Nov 4, 2008||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US7502659||Oct 3, 2006||Mar 10, 2009||Micron Technology, Inc.||Sorting a group of integrated circuit devices for those devices requiring special testing|
|US7561938||Oct 6, 2006||Jul 14, 2009||Micron Technology, Inc.||Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs|
|US7682847||Oct 9, 2008||Mar 23, 2010||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US7738988||Jun 14, 2007||Jun 15, 2010||Micron Technology, Inc.||Process and method for continuous, non lot-based integrated circuit manufacturing|
|US7875821||Oct 9, 2008||Jan 25, 2011||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US7885782||Oct 17, 2006||Feb 8, 2011||Micron Technology, Inc.||Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture|
|US8315730||May 10, 2010||Nov 20, 2012||Micron Technology, Inc.||Methods for non lot-based integrated circuit manufacturing|
|US8600540||Sep 13, 2012||Dec 3, 2013||Micron Technology, Inc.||Methods for non-lot-based manufacturing of articles|
|US20020183884 *||Jul 25, 2002||Dec 5, 2002||Jones Mark L.||Method for continuous, non lot-based integrated circuit manufacturing|
|US20020189981 *||Aug 13, 2002||Dec 19, 2002||Beffa Raymond J.||Method for sorting integrated circuit devices|
|US20030060996 *||Jul 23, 2002||Mar 27, 2003||John Yi||Semi-automated multi-site system tester|
|US20030191550 *||Mar 27, 2003||Oct 9, 2003||Salman Akram||Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's undergo, such as additional repairs|
|US20040024551 *||Jun 19, 2003||Feb 5, 2004||Beffa Raymond J.||Method in an integrated circuit (IC) manufacturing process for identifying and redirecting IC's mis-processed during their manufacture|
|US20040172152 *||Mar 2, 2004||Sep 2, 2004||Beffa Raymond J.||Sorting a group of integrated circuit devices for those devices requiring special testing|
|US20050189267 *||Apr 8, 2005||Sep 1, 2005||Beffa Raymond J.||Method for sorting integrated circuit devices|
|US20050228606 *||Jun 10, 2005||Oct 13, 2005||Beffa Raymond J||Method in an integrated circuit (IC) manufacturing process for identifying and redirecting ICs mis-processed during their manufacture|
|US20060030963 *||Sep 29, 2005||Feb 9, 2006||Beffa Raymond J||Sorting a group of integrated circuit devices for those devices requiring special testing|
|US20070086644 *||Oct 6, 2006||Apr 19, 2007||Kevin Wilson||Non-lot based method for assembling integrated circuit devices|
|US20070088451 *||Oct 6, 2006||Apr 19, 2007||Salman Akram||Method for using data regarding manufacturing procedures integrated circuits (ICS) have undergone, such as repairs, to select procedures the ICs will undergo, such as additional repairs|
|US20070239307 *||Jun 14, 2007||Oct 11, 2007||Jones Mark L||Process and method for continuous, non lot-based integrated circuit manufacturing|
|US20070239308 *||Oct 3, 2006||Oct 11, 2007||Beffa Raymond J||Sorting a group of integrated circuit devices for those devices requiring special testing|
|US20100222913 *||May 10, 2010||Sep 2, 2010||Micron Technology, Inc.||Methods for non lot-based integrated circuit manufacturing|
|US20110089088 *||Dec 28, 2010||Apr 21, 2011||Micron Technology, Inc.||Method for sorting integrated circuit devices|
|US20140085571 *||Dec 17, 2012||Mar 27, 2014||Boe Technology Group Co., Ltd.||Liquid Crystal Module Detection Apparatus For Detecting Image-Sticking, And Detection And Evaluation System And Method|
|WO2008098655A2 *||Jan 16, 2008||Aug 21, 2008||Hatec Handhabungstechnik Maschinenbau Gmbh||Contacting station for testing test samples under thermal conditions|
|WO2008098655A3 *||Jan 16, 2008||Nov 13, 2008||Hatec Handhabungstechnik Masch||Contacting station for testing test samples under thermal conditions|
|U.S. Classification||228/104, 228/103, 228/56.5, 209/573|
|International Classification||H05K13/00, G01R31/28|
|Cooperative Classification||G01R31/2817, H05K13/0061|
|European Classification||G01R31/28B5E, H05K13/00N|
|Oct 29, 1999||FPAY||Fee payment|
Year of fee payment: 4
|Nov 24, 2003||SULP||Surcharge for late payment|
Year of fee payment: 7
|Nov 24, 2003||FPAY||Fee payment|
Year of fee payment: 8
|Nov 19, 2007||REMI||Maintenance fee reminder mailed|
|May 14, 2008||LAPS||Lapse for failure to pay maintenance fees|
|Jul 1, 2008||FP||Expired due to failure to pay maintenance fee|
Effective date: 20080514